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To nurture cyberinfrastructure practitioners, and as part of the WHPC initiative, the Rosen Center for Advanced Computing (RCAC), a division within Purdue IT, extends partial travel assistance to undergraduate and graduate students, empowering their participation in various national conferences aligning with WHPC's objectives. Applicants are assessed on their demonstrated experience with advanced computation and must explain what they hope to gain from participating in the conference. To be eligible, an applicant must identify as a woman and be an undergrad or graduate student maintaining good academic standing. For full eligibility requirements and to apply for this scholarship, please review the eligibility section and complete scholarship guidelines below.


We will review all applications 60 days in advance of relevant conferences, such as Society of Women Engineers, Grace Hopper, and others, in order to ensure equal opportunity is given to all applicants.  If we still have scholarship spots for a conference available after this we will review any additional applications 30 days in advance. We will update the website accordingly to reflect when all spots have been allocated.

SC Conference

SC Conference Series: Supercomputing

SC 24 Logo


Practice & Experience in Advanced Research Computing (PEARC)

PEARC 24 Logo


TAPIA Conference:TAPIA

TAPIA Conference Logo

Other Conferences

A list of conferences in which applications still being accepted include:

The following scholarship applications closed thru 6/30/2025:


This partial grant opportunity is available to undergraduate and graduate students who identify as a women in good academic standing with a GPA of 2.50 or higher. Preference will be given to students that submit a poster or technical paper to the conference. Please see the Scholarship Guidelines document for more details.

How to Apply for Travel Support

To apply to a conference, complete this survey no later than 30 days prior to the conference start date.

Apply Today

Contact our WHPC staff at for more information.